Products

Oxide Film/Nitride Film PECVD System Cetus

Deposition/Annealing

SiO2/SiN PECVD System for Low-Stress Silicon Nitride and Thick Silicon Oxide Film Formation.

Oxide Film/Nitride Film PECVD System
Silicon Oxide Film for TSV Embedding
Silicon Oxide Film for TSV Embedding
Thick Silicon Oxide Film Deposition
Thick Silicon Oxide Film Deposition
Low-Stress SiN Deposition (Provided by Cambridge Univ.)
Low-Stress SiN Deposition
(Provided by Cambridge University)
Oxide Film Deposition on AI Wiring
Oxide Film Deposition on AI Wiring

Feature

Fast and crack-free thick silicon oxide film formation for various MEMS devices and optical waveguide applications
Excellent step coverage for small-diameter, high-aspect ratio structures in TSV applications with low-temperature SiO2 film deposition
Low hydrogen content, high-quality silicon nitride film formation for compound semiconductor passivation applications
Low-stress silicon nitride film formation for MEMS membrane applications
Supports transport systems from vacuum load-lock to cluster types, suitable for both R&D and mass production

Application

MEMS Devices *

Inkjet Printer Heads

3D Through-Silicon Vias (TSV)

Power Devices (Power Semiconductors)

LEDs

Optical Devices

RF Devices (High-Frequency Devices)

* MEMS Devices: Accelerometers, Gyroscopes, Pressure Sensors, Silicon Microphones, Silicon Resonators, Optical Switches, etc.

Other Products for Deposition / Annealing