Products
Oxide Film/Nitride Film PECVD System Cetus
Deposition/AnnealingSiO2/SiN PECVD System for Low-Stress Silicon Nitride and Thick Silicon Oxide Film Formation.
Feature
- Fast and crack-free thick silicon oxide film formation for various MEMS devices and optical waveguide applications
- Excellent step coverage for small-diameter, high-aspect ratio structures in TSV applications with low-temperature SiO2 film deposition
- Low hydrogen content, high-quality silicon nitride film formation for compound semiconductor passivation applications
- Low-stress silicon nitride film formation for MEMS membrane applications
- Supports transport systems from vacuum load-lock to cluster types, suitable for both R&D and mass production
Application
MEMS Devices *
Inkjet Printer Heads
3D Through-Silicon Vias (TSV)
Power Devices (Power Semiconductors)
LEDs
Optical Devices
RF Devices (High-Frequency Devices)
* MEMS Devices: Accelerometers, Gyroscopes, Pressure Sensors, Silicon Microphones, Silicon Resonators, Optical Switches, etc.
Other Products for Deposition / Annealing
Product Categories
Contact About Equipment
+81 6-6489-5997
Get Product Support
+81 6-6489-5848
Have questions or need assistance?
Get in touch via email.