Products
SiC, Compound Semiconductor / Oxide Film Etching System Spica/Sirius
Other Materials EtchingSiC, Compound Semiconductor/SiO2 Etching System for difficult-to-etch materials such as compound semiconductors and optical devices.
(Provided by RFMD)
Feature
- High-density plasma source optimized for processes such as compound and oxide film etching
- Achieves world-leading etch rate for SiC etching, especially for high-frequency and power devices
- Enables high-speed etching of difficult-to-etch materials like silicon oxide films and LiNbO3 for photonics devices
- Can etch organic films, such as resins, with vertical anisotropic etching
- Offers a range of transport systems from vacuum load-lock to cluster types, supporting both research and mass production
Application
3D Through-Silicon Vias (TSV)
Power Devices (Power Semiconductors)
LEDs
Optical Devices
RF Devices (High-Frequency Devices)
Other Products for Etching of Other Materials
Product Categories
Contact About Equipment
+81 6-6489-5997
Get Product Support
+81 6-6489-5848
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