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Mass-production silicon deep etching equipment Predeus / Proxion
Silicon deep etchingSi Deep RIE System
A mass-production silicon deep etching equipment for MEMS and semiconductor applications, established by adding proprietary technologies to the Bosch process.
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What Makes the Predeus Si DRIE System the Leading Choice for Advanced Etching Processes
Feature
- Achieving the world’s highest selectivity and etch rate while maintaining vertical etching profiles, sidewall roughness, and CD (critical dimension) loss.
- Realizing a wide range of etching profiles through a comprehensive process library.
- Applicable to semiconductor applications such as power MOSFETs and through-silicon vias (TSVs) on 200mm and 300mm wafers.
- Offering a range of transport systems from vacuum load-lock types to cluster types, suitable for both research and development as well as mass production.
Application
MEMS Device *
Inkjet printer head
3D through-silicon vias (TSVs)
Power devices (power semiconductors)
LED
Optical devices
RF devices (high-frequency devices)
* MEMS devices: accelerometers, gyroscopes, pressure sensors, silicon microphones, silicon resonators, optical switches, and more.
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Contact About Equipment
+81 6-6489-5997
Get Product Support
+81 6-6489-5848
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