Products
Thermal Process System (Vertical Furnace) SPT Microtechnologies USA. AVP/RVP-300
Deposition / Heat Treatment
Thermal Process System (Vertical Furnace) Vertical Furnace System
Capable of providing the optimum process at high throughput for various requirements.
Feature
- Capable of depositing oxide films, doped/undoped polycrystalline silicon films and nitride films
- Capable of depositing low-stress nitride film deposition and providing in-situ cleaning
- Capable of smallest footprint for dual-boat system
- Capable of high throughput by dual-boat adoption
- Capable of suppressing natural oxide film during standby mode by low oxygen atmosphere in the load lock
- Capable of consolidation process of 150mm and 200mm wafer (AVP)
- Capable of up to 300mm wafer process (RVP-300)
- Capable of providing within wafer uniformity and reducing batch variation by Across-Flow Injector
Application
MEMS Device*
Inkjet Printer Head
Three-dimensional through silicon via (TSV)
Power Device (Power semiconductor)
LED
Optical Device
RF Device (High Frequency Device)
MEMS Device: Accelerometer, Gyro sensor, Pressure sensor, Silicon microphone, Silicon resonator, Optical switch
Deposition/Heat Treatment Other Products
Contact About Equipment
+81 6-6489-5997
Get Product Support
+81 6-6489-5848
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