Products

300mm Si DRIE System for high-volume production

Silicon deep etching

300mm-Compatible Mass Production Silicon Etching System for MEMS devices and 3D Through-Silicon Vias (TSV).

R&D Silicon Etching Equipment
CIS-Specific Taper Etching
CIS-Specific Taper Etching
High-Speed Etching for TSV (Provided by ITRI)
High-Speed Etching for TSV
(Provided by ITRI)
High Aspect Ratio Etching (Provided by AIST)
High Aspect Ratio Etching
(Provided by AIST)

Feature

Silicon etching equipment compatible with 300mm and 200mm wafers
Utilizes a proprietary plasma source developed in-house
High-speed etching with excellent mask selectivity and uniformity
Supports processes such as mask formation and wafer thinning, in addition to TSV hole formation
　　　　　　　
Stable transport system, capable of handling up to 3 chambers (VPX) / 4 chambers (CPX)

Application

MEMS Devices *

Inkjet Printer Heads

3D Through-Silicon Vias (TSV)

Power Devices (Power Semiconductors)

LEDs

Optical Devices

RF Devices (High-Frequency Devices)

* MEMS Devices: Accelerometers, Gyroscopes, Pressure Sensors, Silicon Microphones, Silicon Resonators, Optical Switches, etc.

Other Products for Silicon Etching

Mass Production Silicon Etching Equipment

Mass Production Silicon Etching Equipment

Predeus / Proxion

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Contact About Equipment

+81 6-6489-5997

Get Product Support

+81 6-6489-5848

Contact About Equipment

+81664895997

Get Product Support

+81664895848

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